ChipScale, Inc.
is a research, engineering, and development company specializing in wafer level packaging. ChipScale derives income from development efforts and licensing of it's developments.
ChipScale is best known for it's Micro SMT® packaging technology which was licensed to Motorola. The Micro SMT technology has been in production since 1990 for microwave diodes by M-pulse Microwave, the original inventors of the technology. ChipScale has
refined the process and developed the technology in a way that has broadened it's implementation potential. No other chip scale packaging technology has been applied in as broad an area as the Micro SMT®
technology to include discretes (diodes, transistors, MOSFETs), integrated passive components (resistor arrays and RC networks), and integrated circuits. ChipScale's recent announcement of its
Face-up Chip™ and its Micro Grid Array™ further expands the options and benefits of wafer level packaging. ChipScale's services include prototype packaging developments and licensing. For
companies interested in finding out more about ChipScale's technology, please contact ChipScale at
info@chipscale.com or call (408) 432-1480. |
